FOR IMMEDIATE RELEASE
Ventiva
Partners with ASUS to Explore Next-Generation Thermal Architectures for
Compact AI Computing Systems
TAIPEI, Taiwan - June 1st,
2026 -
Ventiva®,
a leader in solid-state cooling solutions, today announced at
Computex 2026 a strategic partnership with ASUS
to explore
next-generation thermal architectures for compact AI computing systems.
Through this collaboration, the companies will evaluate how Ventiva's
ionic cooling technology can support future ASUS NUC and Mini-PC
designs.
As AI workloads demand more processing power in increasingly
constrained form factors, thermal management has emerged as one of the
most critical factors in system design. Conventional cooling solutions
consume significant board space, restrict component placement, and
generate significant vibrations that introduce acoustic tradeoffs that
become harder to absorb as devices grow more compact and more powerful.
Ventiva's ionic cooling solutions deliver silent, vibration-free
thermal management in a modular, compact form factor that recovers
board space and expands layout flexibility for system designers.
Through this partnership, Ventiva and ASUS will explore the potential
role of Ventiva’s ionic cooling in future ASUS AI system architectures,
assessing where the technology could deliver the greatest design impact.
As part of this partnership, Ventiva is showcasing an ASUS NUC
demonstration platform at Computex 2026. The system illustrates the
direction of the collaboration and provides a real-world platform for
evaluating thermal architecture possibilities in compact AI-capable
designs.
“Thermal management has always been treated as a component-level
decision. What we're seeing now, and what this partnership with ASUS
reflects, is that it's becoming a platform architecture decision. How
you cool a system determines what you can build,” said Christian
Schlachte, Director, Product Management, Ventiva. “We're excited to
work with ASUS to demonstrate what the shift to a ‘thermal first’
architecture makes possible."
“Thermal architecture is becoming an increasingly important part of how
next-generation compact AI systems are designed,” said Alex Gilpin,
Senior Manager - NUC Advanced Engineering, ASUS. “Our partnership with
Ventiva reflects a shared interest in exploring new approaches that
could help shape future ASUS NUC and Mini-PC designs. This initial
phase focuses on prototype development and technical evaluation as both
teams assess what is possible.”
Technical
Background: Ventiva Ionic Cooling Technology
Ventiva’s solid-state, all-electronic heat transfer technology
leverages the principles of electrohydrodynamic (EHD) flow to move
ionized air molecules within an electric field. This ionic cooling
innovation moves air without mechanical fans, creating silent,
vibration-free airflow. Unlike traditional cooling systems, Ventiva
solutions scale easily, integrate cleanly into system designs, and
enable airflow configurations that were not previously possible.
The Ventiva thermal management subsystem is thin, lightweight, and
highly modular, and is engineered to adapt to diverse system
architectures. It is comprised of a self-contained air blower device,
fin stack, and vapor chamber or heat pipe, delivering optimized cooling
efficiency up to 1.1 CFM per device. The air blower devices can be
positioned adjacent to heat sources including SoCs, memory, and power
delivery components, without the space constraints imposed by
traditional fan-based cooling.
Frequently
Asked Questions
- What is ionic cooling, and how does it work?
Ionic cooling uses electrically charged particles to move air without
any rotating parts. Ventiva's ionic cooling technology harnesses the
power of a minuscule plasma field to move air particles, delivering
targeted cooling that removes heat from targeted areas of a system. The
result is a solid-state cooling solution with no mechanical parts, no
vibrations, and no noise.
- Does ionic cooling produce any noise?
No. Ventiva’s ionic cooling technology has been tested in anechoic
chambers, showing less than 15 dBa sound pressure. This is an
imperceptible level that is barely above the background noise level in
an anechoic chamber.
- How thin are Ventiva's air blower devices, and
where can they be placed in a system?
Unlike traditional blowers which are “top-in / side-out” air flow
devices, Ventiva’s ionic cooling module does not need an air gap to
draw in air; it is a more space-efficient “side-in / side-out” device.
This allows for a lower internal height for a customer application as
low as 5 mm, which enables thinner product designs.
- Why is ionic cooling particularly well-suited for
AI workloads?
AI workloads generate intense, concentrated heat at the processor, as
well as the memory and accelerator components operating in close
proximity to the SoC. Conventional cooling solutions struggle to
address these distributed heat sources without adding bulk or noise.
Ventiva's modular approach allows each thermal zone to be cooled
independently and precisely, so the system can sustain the kind of
continuous, high-performance operation that AI applications demand.
Learn
More
About
Ventiva
Ventiva is transforming thermal management from a system constraint
into a design enabler. Its patented, solid-state ionic cooling
platforms use electrohydrodynamic (EHD) technology to deliver targeted
airflow—with no moving parts, noise, vibration, or dust—freeing
critical board space, enabling chip-adjacent memory, and allowing
components to sustain peak performance without throttling. These
modular platforms unlock new system architectures that deliver higher
performance and greater efficiency with unprecedented design
flexibility, across applications from thin-and-light AI inference
laptops to real-time industrial vision systems to high-density server
racks. Learn more at ventiva.com
or follow us on LinkedIn.
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